This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
Various theories or mechanisms of adhesion
Surface (physical or chemical) characterization of materials as it pertains to adhesion
Surface cleaning as it pertains to adhesion
Ways to improve adhesion
Unraveling of interfacial interactions using an array of pertinent techniques
Characterization of interfaces / interphases
Polymer-polymer adhesion
Metal-polymer adhesion  (metallized polymers)
Polymer adhesion to various substrates
Adhesion of thin films
Adhesion of underfills
Adhesion of molding compounds
Adhesion of different dielectric materials
Delamination and reliability issues in packaged devices
Interface mechanics and crack propagation
Adhesion measurement of thin films and coatings