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Handbook of Thin Film Deposition / Edition 3
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Handbook of Thin Film Deposition / Edition 3 in Franklin, TN
Current price: $199.00
Barnes and Noble
Handbook of Thin Film Deposition / Edition 3 in Franklin, TN
Current price: $199.00
Loading Inventory...
Size: OS
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issuesas feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications.
Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries.
The new edition takes covers the transition taking place in the semiconductor world from Al/SiO
2
to copper interconnects with low-k dielectrics.
Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM.
Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications.
Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries.
The new edition takes covers the transition taking place in the semiconductor world from Al/SiO
2
to copper interconnects with low-k dielectrics.
Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM.
Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry.
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issuesas feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications.
Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries.
The new edition takes covers the transition taking place in the semiconductor world from Al/SiO
2
to copper interconnects with low-k dielectrics.
Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM.
Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications.
Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries.
The new edition takes covers the transition taking place in the semiconductor world from Al/SiO
2
to copper interconnects with low-k dielectrics.
Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM.
Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry.
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