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VLSI-SoC: Forward-Looking Trends in IC and Systems Design: 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers

VLSI-SoC: Forward-Looking Trends in IC and Systems Design: 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers in Franklin, TN

Current price: $54.99
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VLSI-SoC: Forward-Looking Trends in IC and Systems Design: 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers

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VLSI-SoC: Forward-Looking Trends in IC and Systems Design: 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers in Franklin, TN

Current price: $54.99
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This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

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